HUAWEI RH8100 V3 is a new HUAWEI server flagship product, supporting up to 8 Intel E7-8800v2 Xeon E7-8800v2 series processors, using leading architecture design, providing excellent computing power and scalability, more than 60 RAS designs, ensuring that the equipment runs steadily like a rock and meets the harshest x86 computing environment requirements, no matter single. A large key application, or multiple server application integration and virtualization, RH8100 V3 is ideal choice.
Key Characteristics Of Original Huawei Fusionserver RH8100 V3 Rack Server With Eight Intel Xeon E7 8800 V2 Series Processors
The industry's leading memory migration technology supports the replacement of memory modules without downtime.
Support memory fault warning, error checking and correction (ECC), dual device data correction DDDC and DDDC+1, mirror image (Mirroring), hot standby (Sparing), and many other memory RAS technologies
HUAWEI FusionPar hard partition technology supports the division of RH8100 V3 into 2 four way servers, which can flexibly adapt to business needs, improve efficiency and protect investment.
Integrating link level fault tolerance and retry function, interprocessor, processor and memory interconnect QPI link, support error data retransmission and standby switch when failure.
Redundant system design, BIOS Flash, RAID card, management software, fan, power supply and other components have redundant functions.
Comprehensive online maintenance capabilities support business continuously, support memory module, PCIe card, hard disk, fan, power, DVD and other modules online replacement.
It supports up to 8 Intel Xeon E7-8800 V2 series CPU, up to 120 computing cores, and the computing performance is doubled than that of the previous generation.
It has 192 memory slot, the largest expansion of 12TB memory, and the total memory capacity increased by 2 times.
Support for ultra low latency Memory-Flash technology, more than half of the time delay compared with the existing PCIe-Flash technology.
Up to 16 PCIe extensions, support I/O intensive applications, and extend up to 38.4TB high speed flash memory space by deploying up to 12 HUAWEI ES3000SSD memory cards
Modular design, easy to maintain, to meet the smooth upgrading of future processors and memory, high-speed I/O design support the next generation of 40G/100G Ethernet network, easy to deal with large data and high bandwidth
HUAWEI independently develops BMC management chip Hi1710, providing omni-directional remote device management, monitoring, configuration, fault location and analysis.
The whole machine avoids tool installation and maintenance, simplifies the operation process, and shortens the time of equipment deployment and maintenance.